| 摘要 |
<p>A semiconductor package with an MR sensor and a hall sensor is provided to make the size of a semiconductor package minimum by manufacturing the semiconductor package with a wafer. A sensor drive chip running a sensor sensing the magnetic field of an X,Y,Z direction is built in the device. A first magnetoresistive sensor sensing the magnetic field of the X-axis direction and a second magnetoresistive sensor sensing the magnetic field of the Y-axis direction are built in a substrate(30). A hall sensor(32) senses the magnetic field of the Z-axis direction while being mounted on the substrate, and sensor drive chip, the first magnetoresistive sensor, and the second magnetoresistive sensor are mounted on the semiconductor wafer. The acceleration sensor(34) is additionally installed on the substrate.</p> |
