| 摘要 |
PROBLEM TO BE SOLVED: To realize a structure for imaging equipment, capable of being miniaturized, and light-weight and robust and assembling in quantity, and furthermore obtaining high quality images. SOLUTION: In this imaging equipment, high performance and miniaturization of the equipment are realized by constituting it of a three-dimensional printed circuit board 1 which is mounted integrally with a lens 2, an optical filter 3, a semiconductor image pickup element 4, a chip component 8 and a printed circuit board 10 and the like, and furthermore through designing of mounting structure, bonding way method, color of adhesive and masking of the lens 2 and the like. |
