HEAT DISSIPATION DEVICE

摘要

A heat dissipation device includes a heat sink and a fan. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The first fin assembly includes a plurality of parallel first fins arranged side by side. A first airflow channel is formed between each two neighboring first fins and communicates with a top side of the heat sink. Each of the second fin assemblies includes a plurality of parallel second fins. A second airflow channel is formed between each two neighboring second fins and communicates with the top side of the heat sink. The first fins are perpendicular to the second fins with the first airflow channels and the second airflow channels communicating with four sides of the heat sink, respectively.