| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste capable of curing in both of an in-line curing method (hot plate curing, or HP curing) and a batch method (oven curing) which are generally used in producing ICs(integrated circuits), and having sufficient adhesive strength, low stressedness and a long pot life. SOLUTION: The paste for a semiconductor and made of a resin comprises (A) 100 pts.wt. of an epoxy resin, (B) 20-60 pts.wt. of a phenolic curing agent, (C) 0.5-5 pts.wt. of a latent curing agent, (D) a silane compound in an amount of 10-60 pts.wt. based on 100 pts.wt. of the total weight of the components (A), (B) and (C), (E) an organic borate (salt) in an amount of 0.5-20 pts.wt. based on 100 pts.wt. of the total weight of the components (A), (B) and (C), and (F) an inorganic filler as essential components. |
