| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which allows formation of micro wiring; and provide a semiconductor device using the wiring board and a manufacturing method of the same.SOLUTION: A wiring board 11 comprises a support medium 12, an adhesive layer 13, a laminate 101 and a laminate 102. The laminate 101 has a first resin layer 14, a second resin layer 19, a connection pad 15 and a wiring pattern 18. The laminate 102 has a third resin layer 21, a fourth resin layer 26, a wiring pattern 25, a bonding pad 27 and a connection terminal 28 for electrical connection with a semiconductor chip 29. The laminate 101 and the laminate 102 are electrically connected via a through via 22 which is provided in a glass layer 20 and filled with a conductor and the like.SELECTED DRAWING: Figure 2 |
