| 摘要 |
PROBLEM TO BE SOLVED: To achieve highly-accurate bonding.SOLUTION: A bonding device according to an embodiment comprises a first holding unit, a second holding unit, a chamber, an imaging unit, a light source, a horizontal position adjusting unit, and a control unit. The first holding unit sucks and holds a first substrate. The second holding unit sucks and holds a second substrate bonded to the first substrate. The imaging unit is arranged outside the chamber, and images alignment marks provided on the first and second substrates via the chamber and a through hole formed in the first holding unit from outside the chamber. The light source is arranged outside the chamber, and irradiates the first and second substrates with light via the chamber and a through hole formed in the second holding unit from outside the chamber. The control unit makes the imaging unit perform imaging processing for imaging the alignment marks of the first and second substrates in a state in which the inside of the chamber is decompressed, and makes the horizontal position adjusting unit perform adjustment processing for adjusting the horizontal position of the first holding unit on the basis of the imaging results of the imaging unit.SELECTED DRAWING: Figure 13 |
