| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of unevenness on a resist film and, hence, suppress a variation in sensor resistance value in a thermal flow sensor chip film deposition process, and further to improve the yield of a thermal flow sensor chip.SOLUTION: Positions of a silicon wafer (silicon substrate) 40 and a silicon wafer (silicon substrate) 52 are aligned so that a composition plane and a groove 52Gi formed on a reverse side of the silicon wafer (silicon substrate) 40 on which a circuit pattern 40SGi is formed face each other, and then a surface of the silicon wafer (silicon substrate) 52 on which the groove 52Gi is formed and a composition plane formed on the reverse side of the silicon wafer (silicon substrate) 40 are pasted together by low-temperature plasma joint.SELECTED DRAWING: Figure 1 |
