发明名称 Vertical DRAM cell with TFT over trench capacitor
摘要 A memory cell which comprises a substrate having a top surface; a capacitor extending vertically into the substrate for storing a voltage representing a datum, said capacitor occupying a geometrically shaped horizontal area; a transistor formed above the capacitor and occupying a horizontal area substantially equal to the geometrically shaped horizontal area, and having a vertical device depth, for establishing an electrical connection with the capacitor, in response to a control signal, for reading from, and writing to, the capacitor, wherein the transistor includes a gate formed near the periphery of said horizontal device area and having a vertical depth approximately equal to the vertical device depth; an oxide layer on an inside surface of the gate; a conductive body formed inside the oxide layer, said conductive body having a top surface and a bottom surface and a vertical depth approximately equal to the vertical device depth; and diffusion regions in the body near the top and bottom surfaces and a method of manufacturing the same is provided.
申请公布号 US2001021553(A1) 申请公布日期 2001.09.13
申请号 US20010765561 申请日期 2001.01.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HORAK DAVID VACLAV;MOHLER RICK LAWRENCE;STARKEY GORDEN SETH
分类号 H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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