发明名称 SPUTTERING TARGET AND SPUTTERING METHOD
摘要 PURPOSE:To easily form a thin film of various mixtures having regulated compositions, by piling up plural sputtering materials prepared by boring plural holes at equiangular spaces through the concentric-circle materials and also by changing the overlapping degree of the holes. CONSTITUTION:Plural holes 2 are bored at equiangular spaces through a disklike sputtering target 1. The holes 2 are similarly bored through other targets 1 of dissimilar materials. Respective targets 1a, 1b, 1c are piled up to be formed into a composite target, which is disposed in a magnetron sputtering device so as to form a mixture thin film on a substrate 3. At this time, respective target sheets 1a-1c are mutually rotated upon a fulcrum to change the overlapping degree of the holes 2, so that respective sputtering areas of the target sheets 1a-1c are controlled. In this way, the regulation of compositional ratio as well as selection of components of the thin film to be sputtered can easily be carried out.
申请公布号 JPS62263964(A) 申请公布日期 1987.11.16
申请号 JP19860104788 申请日期 1986.05.09
申请人 UBE IND LTD 发明人 INOUE KAZUO;YOSHIKIYO MOTOZO;YOSHII SHIZUKA
分类号 C23C14/34 主分类号 C23C14/34
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