发明名称 Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material
摘要 The heat loss of power semiconductors is carried away by box-type cooling units (1), made of conductive material (Cu, Al) with a fluid inlet (2) and outlet (3) and several cooling channels (5) separated by webs (4). The cooling box is electrically insulated by a 1-3 mm thick layer (6) made of unsaturated polyester and/or epoxy resin and/or modified polyestyrene such as STYCAST (RTM). The outer part (7) is made of copper. ADVANTAGE - This insulating material combines an effective electrical separation with a good heat conductivity and ensures that the unit has a high cooling capacity.
申请公布号 DE3937130(A1) 申请公布日期 1990.05.31
申请号 DE19893937130 申请日期 1989.11.08
申请人 ASEA BROWN BOVERI AG, BADEN, AARGAU, CH 发明人 SCHMID, GUENTER, DIPL.-ING., 7897 KUESSABERG, DE
分类号 H01L23/473 主分类号 H01L23/473
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