| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treating device capable of reducing the load of maintenance necessitated by the contamination of a dielectric top plate in the plasma treatment and easily performing the maintenance. SOLUTION: The contamination of the dielectric top plate 4 caused by the deposition of the by-product produced during the plasma treatment or an etching material to be etched is prevented by arranging a dielectric deposition preventing plate 2 having many through holes 5, 6 and 7 having the tilted angle, the bending point or the curved part to be in contact with the vacuum side of the dielectric top plate. |
