| 发明名称 |
WAFER POLISHING HEAD AND POLISHING DEVICE USING IT |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing head having a small installation space, and a polishing device using it. SOLUTION: The wafer polishing head 1 supports a sub carrier 6 (a floating part 8) in a floating manner relative to a head main body 2 through a diaphragm 5, the outside diameter of the sub carrier 6 is made larger than that of the head main body 2. |
| 申请公布号 |
JP2001260012(A) |
申请公布日期 |
2001.09.25 |
| 申请号 |
JP20000073093 |
申请日期 |
2000.03.15 |
| 申请人 |
MITSUBISHI MATERIALS CORP;MITSUBISHI MATERIALS SILICON CORP |
发明人 |
KOBAYASHI TATSUNOBU;TANAKA HIROSHI;MORITA ETSURO;HARADA SEISHI |
| 分类号 |
B24B37/005;B24B37/04;B24B37/30;H01L21/304 |
主分类号 |
B24B37/005 |
| 代理机构 |
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