TABLE FOR WAFER POLISHING DEVICE, POLISHING METHOD FOR SEMICONDUCTOR WAFER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a table for a wafer polishing device, capable of efficiently performing polishing even when CMP is performed and obtaining the suitable polishing state, and excellent in chemical resistance and abrasion resistance. SOLUTION: The table 2 is one of parts for constituting a wafer polishing device 1. The table 2 is made of a silicon carbide base material and has a polishing surface 2a on the upper part. Recesses 21 are formed on the polishing surface 2a. Semiconductor wafers 5 held on holding surfaces 6a of wafer holding plates 6 are brought into direct-contact with the polishing surface 2a.