| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the chipping off of a corner part on the side of the active surface of a semiconductor chip. SOLUTION: The semiconductor chip 2 is joined face down to the surface 11 of a wiring substrate 1. A stiffener 4 is arranged on the surface 11 of the substrate 1 so as to surround the periphery of the chip 2. A gap between the surface 11 of the substrate 1 and the active surface 21 of the chip 2 is filled with filler 7 by injecting resin material in the state of a comparatively viscid liquid from a gap generated between this stiffener 4 and the chip 2, after joining the chip 2 to the substrate 1 and arranging the stiffener 4. This filler 7 is projected from between the surface 11 of the substrate 1 and the surface 21 of the chip 2 to cover a corner part on the surface 21 of the chip 2. |
