THERMOPLASTIC RESIN COMPOSITION

摘要

PURPOSE:To provide a thermoplastic resin composition capable of forming a molding resistant to the lowering of toughness with heat and having excellent impact strength and heat-resistance and suitable for connector. CONSTITUTION:The objective composition is produced by compounding (A) 100 pts.wt. of an aromatic polyamide having an intrinsic viscosity of 0.5-3dl/g and a melting point of >300 deg.C and consisting of a recurring unit composed of (i) dicarboxylic acid unit composed of terephthalic acid component unit and other aromatic dicarboxylic component unit and/or aliphatic dicarboxylic acid unit and (ii) diamine component unit composed of aliphatic diamine component unit and/or alicyclic diamine component unit with (B) 10-80 pts.wt. of a graft- modified olefin polymer and/or graft-modified aromatic vinyl hydrocarbon- conjugated diene copolymer (or its hydrogenated product), (C) 5-80 pts.wt. of an aliphatic polyamide and, as necessary, (D) 0.05-2 pts.wt. (based on 100 pts.wt. of A+B+C) of a phosphorus-based antioxidant.