| 摘要 |
PURPOSE:To enhance a wiring layer formed on a contact hole in step coverage by a method wherein the opening of the contact hole is tapered. CONSTITUTION:The inner lower part of an opening pattern of a resist 2 is irradiated with far ultraviolet rays 4 for the formation of a hardened part 2a. The resist 2 is exposed to light through a wide opening mask and then developed. A tapered contact hole is formed by the use of a tapered resist formed as above. |
