| 摘要 |
PURPOSE:To allow use at 400 deg.C or higher conditions and keep heat resistance after processing by providing a conductor with a non-organic polymer group paint baked layer and an organic polymer group heat-resistant paint baked layer, including non-organic filler, in sequence. CONSTITUTION:A layer 2 where paint is baked which non-organic filler, as necessary, is incorporated in, which is dissolved or dispersed in a proper amount of solvent and which has binder mainly containing non-organic polymer is formed on a conductor 1, preferably at 250-350 deg.C. In addition, a layer 3 where heat-resistant organic polymer group paint is baked which non-organic filler and other additives, as necessary, are incorporated in and which is dissolved or dispersed in a proper amount of solvent is formed on the layer 2. In this case, the amount of non-organic filler is preferably incorporated therein at 20-60 pts.wt. respective to 100 pts.wt. polymer component. As such a wire is excellent on flexibility at 400 deg.C or higher, processing such as coiling is applicable and heat resistance is kept after processing. A layer where organic polymer group heat-resistant paint not containing non-organic filler is baked may be provided on the layer 3. |
