| 摘要 |
PROBLEM TO BE SOLVED: To provide a supply method of a chip which can be automatically separated, at a high speed, a cover tape stuck on the upper surface of a tape and expose a chip accommodated in a pocket of the tape, in an electronic component mounting equipment. SOLUTION: A tape 3 on a base stand 1 is sent by 1 pitch with a sprocket, and a chip W in a pocket 17 is transferred to a pickup area PA of a nozzle 16 of a transfer head 15. By a roller 11 installed in the winding-up path of a cover tape 19, the cover tape is wound up by half pitch, and the cover tape 19 on a pocket 17 is separated to expose the chip W in the pocket 17. The nozzle 16 of a transfer head 15 picks up the chip W, and transfers and mounts it on a board. |
