| 摘要 |
PROBLEM TO BE SOLVED: To realize a photo diode array module which ensures high yield and high reliability and is reduced in size by flip-chip-bonding a signal read circuit to a photo diode array through solder bumps. SOLUTION: A photo diode array 20 having photosensitive parts 21 of photo diodes disposed on the top face of a printed circuit board 40 and lead wires of these parts 21, signal lines and power line interconnection pattern formed on the board 40 is fixed to the board 40, a signal lead circuit 30 to lead signals of the photosensitive parts 21 has an electrode forming area at one side and is disposed so that this electrode area faces the top face of the array 20 and connected through solder bumps to a pattern of the array 20 and the array 20 is connected to the board 40 by the wire bonding 50. |
