| 摘要 |
PROBLEM TO BE SOLVED: To enable strict control of coplanarity and enable a number of connections in a small unit area without increasing the number of layers, by using a pole grid array format and a single-layer ceramic plate board having a number of vias which are filled with bimetal and precisely positioned. SOLUTION: On a single-layer board having predetermined patterns of vias 22, 25, a plurality of circuit tracers extending from a plurality of wire bonding pads 19 or flip-flop mounting pads are provided for the plurality of vias 22, 25 in order to cause electric contact with each other. A protector 32 protects the vias 22, 25, the tracers, the wiring bonding pads 19, wire bonds 20 and a die 30 from the environment. On a surface opposite to the board surface where the die 30 is provided, a plurality of conductive balls 17 are provided. Thus, strict control of coplanarity is enabled without increasing the number of layers. |
