| 摘要 |
<p>PROBLEM TO BE SOLVED: To lower the device cost by eliminating the need for a large scale structure by fixing a positioning claw for positioning a semiconductor pellet mounted on a bond stage to a bonding head or an XY-table whereon a bonding head is mounted. SOLUTION: A positioning claw 16 is fixed to an XY table 7 and a lower surface of the positioning part 16a is formed to a shape corresponding to a corner part of a semiconductor pellet 10 mounted on a bond stage 15. When a semiconductor pellet starts to be transferred onto the bond stage 15, weak vacuum of a suction hole 15a is turned on in a suction state. Then, an XY table is driven so that the positioning part 16a of the positioning claw 16 presses a corner part of the semiconductor pellet 10. When it presses the semiconductor pellet 10 to a predetermined positioning place, the weak vacuum changes to a strong vacuum and it is sucked to the bond stage 15 firmly. The positioning claw 16 may be provided to a bonding head 5.</p> |
