USE OF MODULATED INDUCTIVE POWER AND BIAS POWER TO REDUCE OVERHANG AND IMPROVE BOTTOM COVERAGE

摘要

PROBLEM TO BE SOLVED: To provide a method and device for realizing an appropriate step coverage for one or more kinds of materials on a substrate by using a sputtered and ionized material. SOLUTION: A plasma is generated and maintained inside a treatment region by coupling energy to one or more kinds of gases. A target 104 disposed inside a treatment region 107 provides a material source which is sputtered and thereafter ionized in plasma atmosphere. During deposition on a substrate 110, the density of the plasma is modulated by changing energy supplied to the plasma. During plasma attenuation, bias to a substrate support member 112 is increased to a relative high power for reinforcing force to attract particle charged positive to the substrate 110 periodically in an afterglow period of the plasma. In one example, a bias to a target is also modulated.