| 摘要 |
PROBLEM TO BE SOLVED: To prevent poor contact from being generated between an IC package terminal and contact pins of a socket main body. SOLUTION: An IC socket 11 is provided with a socket main body having a placing part, a plurality of contact pins 16 capable of being brought into contact with and separated from a terminal provided on the lower surface of an IC package, and a presser cover pivotally mounted on the socket main body. A pressing means for bringing a corner part on the opposite side to a corner part on the diagonal line into contact with a guide protrusion 17d with closing of the presser cover 14 is provided. The pressing means is provided with a cantilevered plate spring 20 having a base end part 20a fixed to the socket main body 13 and approximately horizontally arranged on the placing part. The plate spring 20 is deformed with closing of the presser cover 14, the corner part of the IC package is pressed in the diagonal direction P by the plate spring 20, and the corner part on the opposite side on the diagonal line to the corner part is brought into contact with the guide protrusion 17d.
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