| 摘要 |
PROBLEM TO BE SOLVED: To avoid deformation of a package due to the thermal expansion of the package, by a simple process for assembling the package in a good state through a method, wherein thermosetting bonding agents and thermoplastic bonding agents are alternately provided on the bonding surface of a heat sink to a printed board, and the heat sink and the printed board are bonded together. SOLUTION: Stiffeners 13, which correspond to a heat spreader 18 and have a quadrangular shape, are provided between a TAB tape (printed board) 12 and the heat spreader (heat sink) 18 in a form encircling a semiconductor chip 11 on the tape 12. The stiffeners 13 are fixed on the tape 12 with a bonding agent 14. The spreader 18 is fixed on each of the chip 11 and the stiffeners 13 with an adhesive mass 19 made to adhere on the rear of the spreader 18 and a silicon elastomer liquid bonding agent (thermosetting bonding agent) 17 coated on the rear of the chip 11 and the upper surfaces of the stiffeners 13. The adhesive mass 19 constitutes a thermoplastic bonding agent, which is not cured when heat is applied to the thermoplastic bonding agent, and can be also made to adhere to the spreader 18 as an adhesive tape coated on the tape beforehand.
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