| 摘要 |
PROBLEM TO BE SOLVED: To provide a gap adjuster, enabling miniaturization and cost reduction. SOLUTION: A first leveling mechanism holds a mask chuck and moves this chuck in a first direction, perpendicular to a mask pattern-formed surface of a mask fixed to the mask chuck. A mask stage supports the first leveling mechanism. A second leveling mechanism holds a wafer chuck. The wafer, held with the wafer chuck, has an exposed surface facing the mask. The second leveling mechanism can move the wafer chuck in the first direction. A wafer stage supports the second leveling mechanism. A first distance sensor mounted on the mask stage measures the distance to the exposed surface of the wafer. A second distance sensor mounted on the wafer stage measures the distance to the mask surface, and the distance to the first distance sensor. |
