发明名称 METHOD OF MOUNTING HEAT RADIATING PLATE OR SHIELDING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method of mounting a heat radiating plate or a shielding plate by which the heat radiating plate or the shielding plate is fixed to a board by screws and then is subjected to dipping to be grounded, thereby reducing the number of man-hours and, when the screws are fastened, preventing the copper foil of an electric part fixed to the heat radiating plate or the shielding plate from being separated. SOLUTION: A conductive body made of a plated wire 3 is fixed to the hole 2 of a board 1 and a heat radiating plate 4 or a shielding plate 7 is fixed to the surface of the board 1 so as to be in contact with the conductive body made of the plated wire 3, and then is subjected to dipping to solder the board 1 to the conductive body made of the plated wire 3.
申请公布号 JP2002204092(A) 申请公布日期 2002.07.19
申请号 JP20010000927 申请日期 2001.01.09
申请人 FUNAI ELECTRIC CO LTD 发明人 ISHIBASHI HIROYUKI
分类号 H01R4/64;H05K7/20;H05K9/00;(IPC1-7):H05K7/20 主分类号 H01R4/64
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