发明名称 ELECTRONIC EQUIPMENT PROVIDED WITH COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide electronic equipment provided with structure capable of efficiently performing necessary cooling without causing the increase of dimension. SOLUTION: The electronic equipment provided with the cooling structure is provided with solid-state image pickup devices 3r, 3g and 3b; electronic circuit boards 4a, 4b and 4c mounting heat radiation elements; guide members 8 for holding these boards 4a, 4b and 4c; fan motors 7a and 7b for forced cooling by air fitted to these members 8; and slits 16a and 16b of the exhaust windows of air from these motors 7a and 7b, and provided on a casing surface on the opposite side of the eye piece part 21a of a view finder 21. The equipment thermally shields the devices 3r, 3g and 3b from the heat radiation elements by using the board 4a and the members 8.
申请公布号 JP2002329991(A) 申请公布日期 2002.11.15
申请号 JP20010129973 申请日期 2001.04.26
申请人 OLYMPUS OPTICAL CO LTD 发明人 TOGAWA TAKESHI
分类号 H04N5/225;H04N5/335;H04N5/369;H05K7/20;(IPC1-7):H05K7/20 主分类号 H04N5/225
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