摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment provided with structure capable of efficiently performing necessary cooling without causing the increase of dimension. SOLUTION: The electronic equipment provided with the cooling structure is provided with solid-state image pickup devices 3r, 3g and 3b; electronic circuit boards 4a, 4b and 4c mounting heat radiation elements; guide members 8 for holding these boards 4a, 4b and 4c; fan motors 7a and 7b for forced cooling by air fitted to these members 8; and slits 16a and 16b of the exhaust windows of air from these motors 7a and 7b, and provided on a casing surface on the opposite side of the eye piece part 21a of a view finder 21. The equipment thermally shields the devices 3r, 3g and 3b from the heat radiation elements by using the board 4a and the members 8.
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