| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus of manufacturing a semiconductor device which can surely transfer a thin silicon wafer and form an organic film having small variation in a pattern dimension within a surface. SOLUTION: Since the silicon wafer 21 can be surely moved onto a transfer tray 11 without causing any displacement by heating the silicon wafer 21 while keeping it fixed on a movable hot plate 1, the silicon wafer 21 can be surely transferred. Also, since an organic film 22 formed on the silicon wafer 21 is heated by the movable hot plate 1 and a fixed hot plate 2, temperature distribution within the surface can be uniformed, and the variation in an organic film within the surface can made small. COPYRIGHT: (C)2005,JPO&NCIPI |
