| 摘要 |
A cooking device includes a cooking plate having an upper surface that is adapted to receive food thereon, and a bottom surface that is opposite to the upper surface, and a thick film heater formed on the bottom surface of the cooking plate. The thick film heater includes a first insulation layer bonded to the bottom surface of the cooking plate, a second insulation layer bonded to the first insulation layer, and a thick film resistive element interposed between and bonded to the first and second insulation layers.
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