| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for packaging a light emitting device capable of surely improving light emission efficiency of the light emitting device to be packaged. <P>SOLUTION: The wiring board 1 for packaging light emitting device comprises a board body 2 of ceramics (insulating material) which has a front surface 3 and a rear surface 4, a cavity 5 which is opened on the front surface 3 of the board body 2 and in which a light emitting device 8 is packaged on its bottom surface 7, and a light reflecting layer 10 formed on a tilted side surface 6 of the cavity 5. The thickness of an Ag layer included on the light reflecting layer 10 is more than 3 μm to 10 μm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
