| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging device and an electronic component packaging method for preventing packaging fail caused by the position deviation of printed solder and for improving productivity. <P>SOLUTION: In the electronic component packaging method for manufacturing a packaged substrate by packaging electronic components on a substrate by solder junction using an electronic component packaging system in which a screen printing machine and the electronic component packaging device are connected, mask opening data are obtained by measuring the opening position of a pattern hole in a screen mask before a screen printing process, and packaging position coordinates in a component packaging operation by a packaging head are computed based on the mask opening data, thus obtaining the tendency of the position deviation of solder without measuring the position of solder after printing each time and preventing packaging fail caused by the position deviation of solder and improving productivity. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
