| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for exposure that can reduce a variation in focus in the surface of a semiconductor substrate even if the semiconductor substrate is curved. <P>SOLUTION: An imaging device 40 is used to inspect whether or not a semiconductor wafer W is curved. When a curvature larger than a designated value is detected by the inspection, the shape of the semiconductor wafer is temporarily corrected by a clamp 20 so that the curvature becomes smaller. Then the semiconductor wafer W is exposed whose shape is temporarily corrected. While the curvature is made smaller, exposure processing is carried out on the substrate W, so that the a variation in focus in the surface of the semiconductor wafer W can be reduced. <P>COPYRIGHT: (C)2007,JPO&INPIT |
