| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an element itself is damaged by a pressing force when a wire is connected with an electrode pad on a semiconductor element. SOLUTION: An electrode pad 2 is formed on a semiconductor element 1 and a layer of protective film 3 is formed on the surface of the element by opening the electrode pad 2. The protective film 3 overlaps the outer circumferential part of the electrode pad 2, and the surface of the electrode pad 2 is opened under a state where an extended part 3a is formed. When a wire is bonded by means of a bonding capillary, forward end of the bonding capillary abuts against the extended part 3a of the overlapping protective film 3. Since it does not touch the electrode pad 2 directly, the electrode pad 2 of the semiconductor element 1 is prevented from being damaged with the pressure of bonding load even under severe bonding conditions. |
