发明名称 SUBSTRATE HEATING AND PROCESSING DEVICE
摘要 A substrate heating device capable of heating a substrate placed on a loading table (104) having a heating means (108) in a treating container (102), comprising a supporting part (202) formed of a first material and supporting the loading table, a sealing part (204) formed of a second material having a heat conductivity different from that of the first material and sealing the supporting part and the treating container, and a connection part (206) for connecting airtight the supporting part with the sealing part, whereby a thermal gradient between the upper and lower parts of the loading table can be reduced by properly selecting the first and second materials having different heat conductivities, and thus the length of the supporting structure of the loading table can be shortened.
申请公布号 KR20080083062(A) 申请公布日期 2008.09.12
申请号 KR20087019232 申请日期 2008.08.05
申请人 TOKYO ELECTRON LIMITED 发明人 SAITO TETSUYA;KASAI SHIGERU
分类号 H01L21/324;C23C16/44;C23C16/458;C23C16/46;H01L21/00;H01L21/205;H01L21/22;H01L21/285;H01L21/304;H01L21/687 主分类号 H01L21/324
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