| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INTERFERENCE |
| 摘要 |
An integrated circuit package system comprising: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.
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| 申请公布号 |
US2009152688(A1) |
申请公布日期 |
2009.06.18 |
| 申请号 |
US20070956132 |
申请日期 |
2007.12.13 |
| 申请人 |
DO BYUNG TAI;KUAN HEAP HOE;HUANG RUI |
发明人 |
DO BYUNG TAI;KUAN HEAP HOE;HUANG RUI |
| 分类号 |
H01L23/552;H01L21/58 |
主分类号 |
H01L23/552 |
| 代理机构 |
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代理人 |
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| 主权项 |
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