发明名称 |
WIRING BOARD AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide: a wiring board arranged so that the discoloration of a porous substrate owing to metal ions going into pores of the substrate can be suppressed more reliably; and a method for manufacturing a light-emitting device.SOLUTION: A method for manufacturing a wiring board comprises the steps of: coating a porous ceramic substrate (10) with a pretreatment liquid (11) which forms a permeation-preventive film (12) for closing pores of the porous ceramic substrate, but is decomposed by baking; forming the permeation-preventive film on the porous ceramic substrate by curing the pretreatment liquid; forming wiring (13) on a surface of the porous ceramic substrate with the permeation-preventive film formed thereon; and baking the porous ceramic substrate with the wiring formed thereon at a temperature which causes the decomposition of the permeation-preventive film.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016092142(A) |
申请公布日期 |
2016.05.23 |
申请号 |
JP20140223475 |
申请日期 |
2014.10.31 |
申请人 |
CITIZEN HOLDINGS CO LTD;CITIZEN ELECTRONICS CO LTD |
发明人 |
FUKUSHIMA MIZUE |
分类号 |
H05K3/12;H01L23/12;H01L33/52;H01L33/62;H05K3/18;H05K3/28 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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