LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD

摘要

Provided is a liquid solder resist composition comprising: a carboxyl group-containing resin; a photopolymerizable compound containing at least one compound selected from the group consisting of photopolymerizable monomers and photopolymerizable prepolymers; a photopolymerization initiator; and titanium oxide. The photopolymerization initiator comprises a bisacylphosphine oxide photopolymerization initiator, a first α-hydroxyalkylphenone photopolymerization initiator that is a liquid at 25 °C, and a second α-hydroxyalkylphenone photopolymerization initiator that is a solid at 25 °C.