| 摘要 |
PROBLEM TO BE SOLVED: To prevent a module from degrading its high frequency characteristics without shortening the length of bonding wires for connecting a dielectric board to a heat sink. SOLUTION: A high frequency circuit has a capacitance-containing element connected to a signal line for transmitting high frequency signals through a first bonding wire, and an impedance matching termination resistor connected to the element through a second bonding wire. A transmission line formed with the first and second bonding wires and the element has a characteristic impedance not lower than the characteristic impedance at the input of the high frequency signals, and the second bonding wire has a higher inductance than that of the first bonding wire. |
