| 摘要 |
PURPOSE: An electronic component of a high frequency current suppression type and a bonding wire for the same are provided to completely suppress a high frequency current even when they are used at a high frequency in a bandwidth from a few tens MHz to a few GHz so as to prevent an electromagnetic interference from occurring. CONSTITUTION: A high frequency current suppressor is disposed on a part or all of the surface of the predetermined terminals at a place other than a mounting portion to be mounted on a circuit board for mounting at least an electronic component and an edge including a connecting portion to a conductive pattern disposed on the circuit board, and that the high frequency current suppressor also has conductivity in a using frequency bandwidth less than a few tens MHz near the mounting portion to be mounted on a circuit board for mounting at least an electronic component. Preferably, the high frequency current suppressor is formed to be a film on a part or all of a surface of the predetermined number of terminals by a sputtering method, or the high frequency current suppressor is formed to be a film on a part or all of a surface of the predetermined number of terminals by a vapor deposition method. |
