发明名称 |
Semiconductor memory device and production method thereof |
摘要 |
A semiconductor memory device includes a silicon substrate having an impurity diffusion region, and a memory cell array. The memory cell array includes conductive layers laminated on the silicon substrate via interlayer insulation layers, a semiconductor layer extending in a direction of the lamination of the conductive layers, a charge storage film disposed between the conductive layers and the semiconductor layer, and an electrode disposed on the conductive layers. A groove having a direction of the lamination as a depth direction and a first direction different from the lamination direction as a lengthwise direction is formed through the conductive layers. The silicon substrate includes a silicide film disposed in the impurity diffusion region along the groove. The memory cell array includes a conductor, which is in contact with the electrode and the silicide film, in the groove. In the first direction, the conductor is shorter in length than the groove. |
申请公布号 |
US9412754(B1) |
申请公布日期 |
2016.08.09 |
申请号 |
US201514850490 |
申请日期 |
2015.09.10 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
Iinuma Toshihiko |
分类号 |
H01L27/115;H01L29/792;H01L29/45;H01L29/417 |
主分类号 |
H01L27/115 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A semiconductor memory device comprising:
a silicon substrate having an impurity diffusion region; and a memory cell array including a plurality of conductive layers laminated on the silicon substrate via interlayer insulation layers, a semiconductor layer extending in a direction of the lamination of the plurality of conductive layers, a charge storage film disposed between the plurality of conductive layers and the semiconductor layer, and an electrode disposed on the plurality of conductive layers, a groove having a direction of the lamination as a depth direction and a first direction different from the lamination direction as a lengthwise direction being formed through the plurality of conductive layers, the silicon substrate including a silicide film disposed in the impurity diffusion region along the groove, and the memory cell array including a conductor, which is in contact with the electrode and the silicide film, in the groove, the conductor having a length in the first direction shorter than a length of the groove in the first direction. |
地址 |
Minato-ku JP |