发明名称 Semiconductor memory device and production method thereof
摘要 A semiconductor memory device includes a silicon substrate having an impurity diffusion region, and a memory cell array. The memory cell array includes conductive layers laminated on the silicon substrate via interlayer insulation layers, a semiconductor layer extending in a direction of the lamination of the conductive layers, a charge storage film disposed between the conductive layers and the semiconductor layer, and an electrode disposed on the conductive layers. A groove having a direction of the lamination as a depth direction and a first direction different from the lamination direction as a lengthwise direction is formed through the conductive layers. The silicon substrate includes a silicide film disposed in the impurity diffusion region along the groove. The memory cell array includes a conductor, which is in contact with the electrode and the silicide film, in the groove. In the first direction, the conductor is shorter in length than the groove.
申请公布号 US9412754(B1) 申请公布日期 2016.08.09
申请号 US201514850490 申请日期 2015.09.10
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Iinuma Toshihiko
分类号 H01L27/115;H01L29/792;H01L29/45;H01L29/417 主分类号 H01L27/115
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A semiconductor memory device comprising: a silicon substrate having an impurity diffusion region; and a memory cell array including a plurality of conductive layers laminated on the silicon substrate via interlayer insulation layers, a semiconductor layer extending in a direction of the lamination of the plurality of conductive layers, a charge storage film disposed between the plurality of conductive layers and the semiconductor layer, and an electrode disposed on the plurality of conductive layers, a groove having a direction of the lamination as a depth direction and a first direction different from the lamination direction as a lengthwise direction being formed through the plurality of conductive layers, the silicon substrate including a silicide film disposed in the impurity diffusion region along the groove, and the memory cell array including a conductor, which is in contact with the electrode and the silicide film, in the groove, the conductor having a length in the first direction shorter than a length of the groove in the first direction.
地址 Minato-ku JP