A process and apparatus for assembling electric microcomponents on printed circuits.

摘要

This invention provides a process and relating apparatus formed of set of gripping means (12) to withdraw and supply a plurality of microcomponents (11) to preselected positions of a board (20) for printed circuits. The process provides that each of the gripping means (12) are initially arranged at the top opening (15) of each microcomponent magazine; then a control member (13) provides to close said gripping means (12); a handling means moves said gripping means (12) from a position substantially corresponding to the free top opening (15) of the microcomponent magazine to another position substantially corresponding to the application position of said microcomponent (11) on said printed circuit board (20); and a means to feed said components along the magazine forming stacks, so as to allow the gradual withdrawn thereof.