| 摘要 |
PURPOSE:To improve productivity, to enhance yield and to elevate quality by exchanging a board with a probe card and unmanning a setup. CONSTITUTION:When a novel kind name is designated, a test head 6 loaded on a main stage 1 for a wafer prober is turned in the left direction, a clamp to an old board is slipped off, a grip carrier mechanism 5 is shifted to the central position of a head plate 7, and grips the old board 4 and is lifted, and the old board is housed into empty housing shelves 3a, 3b... through a horizontal movement process. When the grip carrier means 5 grips a novel board 4 corresponding to the kind name designated, is transferred to the central position of the head plate 7 and inserts the novel board 4, the board 4 is clamped by air, etc. because the board 4 is set at horizontal X.Y positions having high accuracy in X.Y rails, and the test head 6 is lowered. The test head 6 is combined with the board 4.
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