| 摘要 |
PURPOSE:To obtain an epoxy resin composition useful for protecting semiconductors, having extremely improved reliability of a transparent sealing material, comprising specific inorganic complex oxide particles and an epoxy resin, making the refractive indexes of the particles and the epoxy resin satisfy a specific value. CONSTITUTION:The objective composition comprises (A) inorganic complex oxide particles (silica-coated inorganic oxide particles prepared by coating the surface of inorganic complex oxide particles preferably with silica) having <=9X10<-6> surface hydroxyl group density and an epoxy resin and the refractive index (NFD) of the inorganic complex oxide particles and the refractive index (NPD) of the cured material of the epoxy resin satisfy the formula. When the material is cured, a cured material having >=50% light transmittance at 589nm is obtained. |
