| 摘要 |
PURPOSE:To suppress the generation of warpage or waving of a ceramic sheet in the binder-removing process at the start of baking in the production of a ceramic substrate for composite part comprising the punching of a ceramic green sheet in rectangular form and baking of the punched sheet and, as a result, to remarkably decrease the cracking defect ratio in the screen printing of an electrode on the baked ceramic substrate. CONSTITUTION:A rectangular piece 1 is punched out from a ceramic green sheet. At least two sides of the circumference of the punched piece are provided with semicircular or V-shaped notches and the piece is baked to obtain a ceramic substrate. |
