发明名称 METAL ELECTROLYZING MOTHER BOARD POLISHING MACHINE AND ELECTRODEPOSITED METAL SEPARATING EQUIPMENT PROVIDED WITH THIS METAL ELECTROLYZING MOTHER BOARD POLISHING MACHINE
摘要 PURPOSE: To improve a work environment by arranging a polishing member opposed with a space for a conveyed metal electrolyzing mother board to pass, and pressing the polishing member to both surfaces of this mother board, so that polishing unevenness relating to the mother board can be reduced. CONSTITUTION: In the case of polishing both surfaces of a metal electrolyzing mother board 1 by each rotary brush 11, 12, a difference between thicknesses of a passing member, generated when a mother board main unit 1a passes and when an edge protector 1c mounted on the mother board passes, is absorbed by automatically changing a space between the rotary brushes 11, 12 through action of opening/closing an opening/ closing mechanism comprising an opening/closing pantograph 31 and a pair of opening/ closing links 35a, 35b. Simultaneously with this absorbing, pressing strength to this mother board is adjusted so as to be fixed. Further, an extending amount of each rod of cylinders 36a, 36b is adjusted, to properly select a polishing pressure of the rotary brushes 11, 12. Thus by polishing the mother board accurately to objective roughness, a problem of inferior separation, in a separation process of an electrodeposited metal, can be surely reduced.
申请公布号 JPH08257883(A) 申请公布日期 1996.10.08
申请号 JP19950072151 申请日期 1995.03.29
申请人 MITSUBISHI MATERIALS CORP 发明人 TANAKA HIDEAKI;OBAYASHI SHIGEKI;MATSUI YUKINORI
分类号 B24B7/10;B24B29/00;C25C7/02;(IPC1-7):B24B7/10 主分类号 B24B7/10
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