发明名称 FILM FORMING METHOD
摘要 PURPOSE: To efficiently form a film where needless impurities are not mixed, by adding a predetermined quantity of hydrogen chloride or chloride into hydrogen when forming a film by plasma vapor phase method. CONSTITUTION: When forming a film on a substrate 1 provided with a reactor by plasma vapor growth method, the alkaline metal such as sodium made on the inwall of a reactor or a substrate holder 2 is cleaned with plasma by the gas where from 1% to 5% hydrogen chloride or chloride is added to plasmatic hydrogen. This is the manufacture of installing a substrate 1 after that in the reactor, and forming a film by plasma vapor growth method. Hereby, a film without dispersion in each processing process and excellent in reproducibility and quality can be obtained.
申请公布号 JPH08321471(A) 申请公布日期 1996.12.03
申请号 JP19960159121 申请日期 1996.05.31
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 C23C16/50;H01L21/205;H01L31/04 主分类号 C23C16/50
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