| 摘要 |
PROBLEM TO BE SOLVED: To prevent development of crack or break on an insulating board due to application of an external force, by applying a wiring conductor made of metal powder bonded by thermosetting resin onto an insulating base made of powder of inorganic insulating material bonded by additional polyimide resin. SOLUTION: An insulating base 1 is formed by stacking three insulating bases 1a, 1b and 1c, and has a recess 1d at a center portion on the upper surface thereof for accommodating a semiconductor device. On the bottom of the recess 1d, a semiconductor device 3 is bonded and fixed by an adhesive, such as, resin. The insulating bases 1a, 1 and 1c forming the insulating base 1 are formed by bonding powder of inorganic insulating material, such as, silicon oxide or aluminum oxide, by thermosetting resin, such as, bismaleimide-based addition type polyimide resin. From the peripheral edge of the recess 1d to the lower surface of the insulating base 1, a wiring conductor 2 made of metal powder of copper or the like bonded by thermosetting resin is applied.
|
