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发明名称
FLIP CHIP BONDING DEVICE
摘要
申请公布号
JPH10163272(A)
申请公布日期
1998.06.19
申请号
JP19960317351
申请日期
1996.11.28
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
SATO SEIICHI
分类号
H01L21/60;H05K3/34;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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