| 摘要 |
PROBLEM TO BE SOLVED: To shorten the time required for mounting a flip chip while protecting the flip chip and a bump against damage and preventing the flip chip from falling in transportation by mounting a removed part onto an object to be mounted while keeping one side of the part to face the earth. SOLUTION: When a push needle 14 is lowered while vacuum sucking an adhesive sheet 113 bonded with a flip chip 115, the flip chip 115 is stripped from the adhesive sheet 113 and fed onto a positioning stage 20. The flip chip 115 is secured on the positioning stage 20 by vacuum suction through a chip suction hole and moved, under that state, by a moving stage to the feeding position for a mounting head 151. The flip chip 115 is subjected, at that position, to positional correction by an XYθ moving mechanism 22 before being delivered to the mount head 151. The mounting head 151 performs mounting onto an object to be mounted previously set on a mount stage 150. |
