| 摘要 |
PROBLEM TO BE SOLVED: To prevent a bonding wire from shifting and make contact with a neighboring bonding wire by coating a part of the bonding wire with a diffused resin, shortening the length of an exposed arc, and coating a chip and bonding wire with a compound material. SOLUTION: After completion of a wire-bonding process, a liquid resin 40 is sport-fitted on a chip 20. Then, the resin 40 is allowed to flow freely. The resin 40 diffuses outward along a bonding wire 30 and eventually coats a part of the bonding wire 30, which is close to the perimeter of the chip 20. Although on epoxy resin is desirably used as the resin 40, its natural must be compatible with a succeeding coating compound material. With a part of the bonding wire 30 coated with a resin after diffusion, the length of arc which can cause deviation in a following process of each single bonding wire is shortened, and no short circuiting is caused even if a very short deviation takes place in the following process. |
